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India's Semiconductor Ecosystem Draws Strong Global Investment Interest, 25 Key Deals Announced at SEMICON India 2026

New Delhi, Sep 18 (UNI) India's semiconductor ambitions received a major boost at SEMICON India 2026, with 25 strategic announcements and collaborations unveiled on Day 2, spanning chip manufacturing, advanced packaging, materials, logistics, power electronics, chip design and workforce development.
Union Minister for Electronics and Information Technology Ashwini Vaishnaw said the strong participation at the event reflects growing global confidence in India as a semiconductor manufacturing and technology hub.
The second day of the three-day event at Yashobhoomi saw a series of agreements aimed at strengthening India's semiconductor supply chain, expanding domestic manufacturing capabilities, developing advanced packaging and power electronics, and creating an industry-ready workforce.
He said country roundtables had also received a positive response, with more than 30 companies each from Japan and Singapore participating in their respective pavilions, besides participation from South Korea and European countries including Belgium, the Netherlands and Sweden.
The minister said the growing participation reflected increasing global interest in expanding semiconductor-related activities in India, adding that industry leaders had indicated their willingness to scale up investments based on their ability to execute projects.
SEMICON India recorded nearly 12,000 visitors on its opening day, most of them industry participants, and has more than 600 exhibitors, including around 300 international exhibitors.
Among the key announcements was an MoU between the India Semiconductor Mission and Nippon Express Holdings to strengthen semiconductor logistics infrastructure, including expertise in logistics, warehousing, customs and supply-chain management.
Tata Electronics announced several partnerships, including with INOX Air Products for high-purity gases, Sumitomo Chemical for high-purity wet chemicals and advanced materials, Kelington Engineering for gas distribution and high-purity piping systems, and Enomoto for advanced semiconductor packaging and lead-frame manufacturing.
C-MET, Pune, and Hindalco Industries also signed an MoU to scale up critical raw materials for the semiconductor ecosystem and strengthen indigenous material capabilities and supply-chain resilience.
MeitY, the Ministry of Power and POWERGRID announced a collaboration to support the indigenisation of silicon carbide power modules for voltage source converter-based high-voltage direct-current transmission systems. The technology will be piloted at POWERGRID's 1,000-MW Pusauli project in Bihar.
L&T Semiconductor Technologies announced collaborations with Virtual Forest, Newen Systems, Fimer India and Capital Power Systems covering power electronics, silicon carbide power modules, IGBTs and IoT modules for smart meters.
Tata Electronics and L&T Semiconductor Technologies also entered into a strategic partnership to explore manufacturing L&T's semiconductor products at Tata's fabrication and OSAT facilities, beginning with consumer-grade camera modules.
Vaishnaw highlighted the importance of sustainability as semiconductor manufacturing and data-centre infrastructure expand in India.
He pointed to extensive water recycling in semiconductor fabrication plants and closed-loop cooling systems in data centres as examples of resource-efficient technologies being adopted by the industry.
The minister also stressed the need for Indian semiconductor companies to compete globally on cost and quality while factoring in manufacturability, product life cycle and power consumption.
A major highlight was the launch of India's first indigenous System-on-Module, IndieSemiC's ISC-VegaSOM, integrating C-DAC's Vega-Thejas32 processor with IndieSemiC's globally certified LoRa-RF module.
The module was developed under C-DAC's Industry Support Centre initiative. Vaishnaw said the launch demonstrated that Indian design companies supported by the Design Linked Incentive programme were moving beyond chip development to bringing products to market.
"With chips now entering final products, India is steadily evolving into a product nation," he said.
India Deep Tech Alliance reported investments of USD 263 million across 56 Indian deep-tech companies.
SEMI and IDTA also announced plans for the India Semiconductor Academy, an industry-led national skilling platform involving companies and academic institutions including Cadence, CG Semi, Dixon Technologies, Micron Technology, Synopsys, 3D Glass Solutions, UC San Diego and IIT Kanpur.
NIELIT signed multiple agreements covering semiconductor design education, workforce development and industry-oriented training with Siemens EDA, Tata Electronics, Singapore Polytechnic International, IESA and SEMI University.
NIELIT and SCL also launched an indigenous 0.8-micron open-source Process Design Kit on the NIELIT eChipHub platform to expand access to chip-design tools for students and innovators.
Silvaco and C-DAC's ChipIN Centre announced a collaboration to provide advanced TCAD tools to startups and MSMEs onboarded under the Design Linked Incentive programme, as well as for C-DAC's research and training initiatives.
Other announcements included OSAT collaboration between Kaynes Semicon and IndieSemiC, development of energy-metering SoCs involving Kaynes Semicon, Microchip Technology and GridCrest Technologies, and cooperation between Kaynes Semicon and United BC Team on advanced intralogistics and lights-out semiconductor manufacturing.
SEMICON India 2026, which concludes on September 19, features more than 600 participating companies and is expected to attract around 50,000 visitors from 52 countries. The event has more than 400 executives and over 150 speakers, besides six country pavilions, 12 state booths, a startup pavilion, innovation showcase, student hackathon and workforce development pavilion.UNI AAB
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