States » SouthPosted at: Oct 13 2026 5:09PM


India must localise chip IP, materials by 2047: SSPL Director

Bengaluru, Oct 13 (UNI) India must move beyond semiconductor design services to develop indigenous intellectual property, manufacturing capabilities and a resilient domestic supply chain, with a long-term goal of sourcing up to 90 per cent of semiconductor materials domestically by 2047, Aneesh Kumar Sharma, Director of the Solid State Physics Laboratory (SSPL), said on Tuesday.
Although India accounts for nearly 20 per cent of the global semiconductor chip design workforce, the country has historically remained confined largely to design services, with limited ownership of intellectual property, Sharma said while outlining a roadmap for semiconductor self-reliance.
He was speaking at the ESTIC-2026 Curtain Raiser event here on Tuesday.
More than 90 per cent of the chemicals and other critical inputs required for semiconductor fabrication, including high-purity gases, wafers and specialised equipment, are imported, exposing vulnerabilities in India's efforts to build a globally competitive semiconductor ecosystem.
Sharma said India needed to develop capabilities across the entire semiconductor value chain, encompassing chip design and electronic design automation, domestic IP ownership, materials and manufacturing equipment, front-end fabrication and advanced packaging.
The global semiconductor industry is concentrated in specialised geographical clusters, with the United States leading in chip design and electronic design automation, Taiwan and South Korea dominating advanced fabrication, and Japan and Europe supplying critical materials and manufacturing infrastructure. China has also developed substantial capabilities in semiconductor fabrication.
India's transition from design services towards manufacturing has begun under its semiconductor programmes, but significant gaps remain in domestic technology ownership, materials production and the commercialisation of indigenous research, he said.
Sharma stressed the need to establish pilot production lines, shared clean-room facilities and advanced process engineering infrastructure to bridge the gap between laboratory research and commercial manufacturing.
Under the proposed roadmap, India should target self-reliance in strategically important mature semiconductor nodes, including 28-nanometre technology, by 2030, while meeting at least 10 per cent of domestic chip requirements through indigenous production.
By 2035, the country should expand its manufacturing capabilities, develop artificial intelligence accelerators and high-bandwidth devices, and strengthen its export potential through greater domestic value addition.
The longer-term ambition should be to establish leadership in selected advanced semiconductor technologies and develop at least two globally competitive foundries, Sharma said.
He identified compound semiconductors, advanced packaging, quantum technologies, photonic integrated circuits and neuromorphic computing as potential areas for India to build specialised technological strengths.
Indigenous capabilities in infrared detectors, focal-plane arrays, micro-electromechanical systems and specialised sensors would also be critical for defence, space and other strategic applications, where access to foreign technologies could be restricted.
Sharma said sustained capital investment, domestic sourcing of critical materials and the development of a skilled workforce would be essential to achieving semiconductor self-reliance.
The roadmap envisages building an integrated ecosystem involving government institutions, private industry, startups, universities and national laboratories to strengthen India's position in the global semiconductor industry and advance the vision of Viksit Bharat by 2047.
UNI BDN
Tags: #India must localise chip IP# materials by 2047: SSPL Director
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